Hiflux technology uses fine arrays of pins laser-welded between plates which provide:
- Large surface area for heat transfer without use of very thin foils
- Extremely robust structure in a compact package
- Excellent flow characteristics – low pressure loss coupled with good flow mixing and distribution
- Ability to withstand significantly elevated pressures
Flow in Pin Array
The pin structure allows for use of a unique semi-compliant manifold system to accommodate large thermal loads.
Heat Exchanger Stack
Heat Exchanger Cell
Hiflux products have been routinely subjected to service temperatures up to 800°C and have been pressure tested to over 1000bar at room temperature. Validated analysis software has been developed, which can accurately predict the performance of any design over a range of conditions.