Technology

Hiflux technology uses fine arrays of pins laser-welded between plates which provide:

  • Large surface area for heat transfer without use of very thin foils
  • Extremely robust structure in a compact package
  • Excellent flow characteristics – low pressure loss coupled with good flow mixing and distribution
  • Ability to withstand significantly elevated pressures

Heat Flow in Pin Array

The pin structure allows for use of a unique semi-compliant manifold system to accommodate large thermal loads.

Heat Exchanger Stack

Heat Exchanger Cell

Hiflux products have been routinely subjected to service temperatures up to 800°C and have been pressure tested to over 1000bar at room temperature. Validated analysis software has been developed, which can accurately predict the performance of any design over a range of conditions.